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Manufacture Capability

发布时间:2018-02-27

Classification

Items

capability

Materials

Base-material

FR4,CEM-3,high frequency,PTFE,halogen-free,Aluminium base material

Material brand

KB,ITEQ,SY,Rogers,Arlon,Ventec,    Laird,or other laminate on customer's request

Min. core thickness

3 mil

Prepreg

1080 , 2116 , 7628 , 7630

Copper foil

1/4 oz ~ 4 oz

Solder mask

Rongda,Taiyo,Nanya or other brand on customer's request

Hole

Min. drill size

0.2mm

Min laser drill size

3mil

Hole diameter tolerance

±0.05mm

Hole location tolerance

±2mil

PTH

Aspect/ratio

12:1

Image transfer

min line width/space

3/3 mil

Finished copper thickness

6 oz

Layer to layer registration

2 mil

Etching

Line width/space tolerance

±10%

Solder Mask

Via plug

via size :0.2-0.8mm

S/M registration

1 mil

solder dam width

4 mil

Finishing

HASL

YES

HAL (Pb-free)

YES

OSP

YES

Immersion silver

YES

Immersion Tin

YES

Gold finger

YES

Immersion gold

YES

Product

Layer count

1~20 layers

Board thickness

0.3 ~ 6 mm

Board thickness tolerance

±5%

max board size

800*650mm

min V-score residuals

0.1 mm

Bow & twist

≤0.50% (max cap)

Outline tolerance

±0.1mm

Impedance control PCB

YES

Blind and buried via PCB

YES(laser and mechanical drill)

High frequency PCB

YES

Selective hard gold PCB

YES

Carbon ink PCB

YES

Aluminium base PCB

YES


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